Public defence: Van Long Huynh

Van Long Huynh will defend his PhD degree in Applied Micro and Nano Technology. The dissertation presents a low-temperature and low-pressure interconnection technology for high density, ultra-fine pitch applications.

24 Feb

Practical information

  • Date: 24 February 2026
  • Time: 10.00 - 15.00
  • Location: Vestfold, Auditorium A1-36 Horten
  • Download calendar file
  • Organizer: Faculty of Technology, Natural Sciences and Maritime Sciences

    • Join digitally (Zoom) 

    Meeting ID: 622 6112 3811

    Password: 283975

    Program

    Kl. 10:15 Trial lecture: “Reliability of flexible electronics and their interconnects”

    Kl. 12:15 Public defence: "Control of Metal-coated Microspheres for Low-pressure, Low-temperature, Fine-pitch Interconnection Technologies"

    Assessment committee 

    • First opponent: Dr.Heiko Wolf, IBM Research Europe–Zurich, Switzerland
    • Second opponent: Dr.Maaike Margrete Visser Taklo, Sonitor Technologies AS, Norway
    • Administrator: Associate Professor Giuseppe Schiavone, University of South-Eastern Norway

    Supervisors

    • Principal Supervisor: Associate Professor  Hoang Vu Nguyen, University of South-Eastern Norway
    • Co-supervisor: Professor Knut E. Aasmundtveit, University of South-Eastern Norway
    • Co-supervisor: Senior Research Scientist Daniel Nilsen Wright, SINTEF MiNaLab, Norway
Any questions?

Van Long Huynh is defending his thesis for the degree philosophiae doctor (PhD) at the University of South-Eastern Norway.

The doctoral work has been carried out at the Faculty of Technology, Natural Sciences and Maritime Sciences.
 

You are invited to follow the trial lecture and the public defence.

Summary

New Method Enables Smaller and More Reliable Electronics at Lower Temperatures

Van Long Huynh´s PhD research focuses on developing new ways to connect electronic components using low temperature and low pressure.

During his PhD, he developed an interconnection method that reduces bonding temperature and pressure compared to conventional approaches such as soldering and thermocompression bonding. This could enable future electronic devices to be smaller, higher performing, and more reliable.

Modern electronic devices rely on extremely small and densely packed connections to link chips and components together. As electronic devices become smaller and more powerful, creating these tiny connections becomes increasingly challenging. Today, manufacturers often rely on high heat and strong pressure to form them. These harsh conditions can damage sensitive materials, limit design flexibility, and increase productionBilde av Van Long costs.

This PhD research demonstrates a new interconnection technology based on tiny metal-coated polymer particles. These particles act like individual connectors and can form connections at low temperature and low pressure.

The study shows that this new approach achieves performance comparable to conventional technologies while significantly reducing the need for harsh processing conditions.

Lower processing temperatures makes it safer to use heat-sensitive materials, such as advanced polymers. At the same time, reduced bonding temperatures lower the mechanical stress that builds up during manufacturing.

Using less pressure further decreases the risk of physical damage, which is especially important for very small or thin components. Together, these improvements can lead to more reliable products and higher manufacturing yield.

This technology opens the door to new types of electronic packaging, especially for advanced applications such as micro-LED displays, ultrasound probes, and wearable devices.