Topics include:
- Packaging/system integration of microelectronics
- Packaging/system integration of medical devices
- Miniaturization of smart systems and devices
- Bonding technologies for harsh environments
- Intermetallic bonding (SLID)
- Conductive adhesive bonding
- Manufacturing processes for ultrasound transducers
- Integration of functional nanomaterials in microelectronics
- Nanostructures of Wide Bandgap semiconductors for photocatalytic applications
The group is responsible for the characterization laboratories at USN, including SEM, optical microscopy, AFM and SAM, as well as bonding/systemintegration tools at chip and wafer level.
The group teaches courses in material science, packaging technology, micro- and nanotechnology, measurements and characterization, at bachelor-, master- and PhD-level.
Projects
Ongoing projects
- A/Nano2021 – GE Vingmed – 36,5, million NOK
- BIA – Conpart – 11,5 million NOK
- Nano2021 – Sensocure - 9,8 million NOK
- FRINATEK – Solmat – 4,4 million NOK
Ongoing PhD projects
- Lars Holhjem, Implantable CO2 sensor for ischemia detection
- Giang Nghiem, Novel Particle Technology for Display Interconnect
- Andreas Larsson, Electronic packaging for harsh environments
- Avisek Roy, Carbon nanotube to CMOS integration for ultra-sensitive gas sensors
- Kim Robert Gusavsen, Converting CO2 to fuels using renewable energy
- Zengxing Zhang, Black silicon technique for solar energy application
- Chaoqun Cheng, Earth-abundant solar energy materials for H2 generation
- Tor Håvard Aasen, Catalyst development for renewable Energy
Networks and partners
Regional industry
The group has strong connection to the regional industry. For more than a decade, the group has coordinated “Norwegian Centre of Expertise – Team Packaging Technology”, a network connecting packaging/systemintegration experts in microelectronics-/microsystem industry companies with USN researchers and other research institutes. For some of these companies, the group has collaboration projects, including:
- GE Vingmed Ultrasound
- Conpart
- Sensonor
- Sensocure
- SINTEF
- Techni
- TegMa
- Memscap
- Oslo University Hospital
International collaborations
The group is further responsible for several of the major international collaborations at USN:
- Joint International Master in Smart Systems Integration (Erasmus Mundus-sponsored Joint Master given together with Heriot-Watt University (Edinburgh, Scotland) and Budapest University of Technology and Economics (Hungary)
- Exchange programme with Vietnamese universities HCMUT and HCMIU (funded through NORPART)
- NanoEl project: E-learning for nanoelectronics, Asia-Europe collaboration (funded through Erasmus +, with TU Sofia and Politechnico Torino as main partners)